Inductor Laser Peeler
Laser peeler focuses the laser beam to the micrometer level and scans back and forth on the surface of the inductor, causing the surface of the inductor to melt and vaporize, forming a certain area of surface removal and exposing the bottom electrode.
Laser peeler is a key equipment in the production process of inductors, used for laser removal of resin/enamel layers of integrated inductors and wound inductors.
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2520/2016/2012Inductor Size
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<±0.05mmStripping Accuracy
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> 21,000 pcs/hPeeling CT
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Product Advantages
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Applications
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Specifications
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Related Products
Product Advantages
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Self-Developed Laser – Cost-Effective & Reliable
JPT's proprietary laser can be customized for specific applications at low cost. Built using top-grade components (fiber, crystal, pump source, etc.) and validated with a 72-hour aging test, ensuring long service life and reliability.
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High-Precision Vision Recognition & Positioning
quipped with a pseudo-coaxial vision system for accurate inductor recognition and positioning. Automatically corrects stripping position and angle deviations, achieving high-precision paint stripping.
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High-Speed Feeding & Arrangement
Uses a high-speed vibration plate and XY + Theta platform with optimized motion sequence to achieve various arrangements such as linear, spiral, and rectangular distributions.
Applications
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Application Effect -
Application Effect -
Application Effect
Demonstration Video
Specifications
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Two side Laser Peeling Machine
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Three side Inductor Laser Peeling Machine
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Product Specification
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Peeling Requirement
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Peeling Accuracy
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Laser Parameters
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Galvo Scanning Area
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Galvo Cutting Speed
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Galvo Repeat Positioning Accuracy
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Marking Card
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Two side Laser Peeling Machine
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Product Specification2520/2016/2012
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Peeling RequirementSingle-side peeling
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Peeling Accuracy≤ ±0.05 mm
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Laser ParametersStandard: UV 15W；
Optional: IR 30W -
Galvo Scanning AreaF254 (Camera lens field of view 76 × 76)
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Galvo Cutting Speed1 mm/s ~ 7000 mm/s
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Galvo Repeat Positioning Accuracy0.01 mm
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Marking CardSelf-Developed
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Three side Inductor Laser Peeling Machine
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Product Specification080506
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Peeling RequirementThree-side peeling
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Peeling Accuracy≤ ±0.05 mm
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Laser ParametersStandard: IR 30W；
Optional: UV 15W -
Galvo Scanning AreaF254
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Galvo Cutting Speed1 mm/s ~ 7000 mm/s
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Galvo Repeat Positioning Accuracy0.01 mm
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Marking CardSelf-Developed
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Related Products
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Laser Thin Film TrimmerMeasurement range 100mΩ-500MΩ, measurement accuracy ±0.01%, supports multiple resistance specifications
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Laser Thick Film TrimmerResistance adjustment range 100mΩ～20MΩ, used for laser resistance adjustment of chip thick film resistors/hybrid circuits (thick film) on ceramic substrates
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Ultra-low Resistance Laser Trimmer0.1mΩ–1MΩ, measurement accuracy: ±0.1%, supports multiple resistor specifications
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Laser ScriberFront and back line repeatability less than ±5 μm, achieving ±0.75μm/70mm straightness and ±1μm positioning accuracy
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Single Chip-resistor TesterUsed for first inspection before laser trimming, re-measurement or final inspection after laser trimming
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High Voltage Resistor TesterUsed to test single-chip resistor substrates, with the withstand voltage characteristics of each resistor before and after resistance adjustment
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TCR TesterUsed for testing the TCR values of individual resistors on single-chip resistor substrates
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Inductor Laser PeelerFor laser removal of resin layers/enamel layers on molded inductors and wound inductors
