Laser Thin Film Trimmer
The thin-film laser trimming machine focuses the laser beam down to the micron level and scans across the resistor surface, melting and vaporizing the resistive paste layer to form grooves of a certain depth. This process alters the conductive cross-sectional area or the conductive length of the resistor.
The thin-film laser trimming machine is a key piece of equipment in the production process of chip thin-film resistors. It is specifically designed for laser trimming of chip thin-film resistors and hybrid circuits (thin-film) based on ceramic substrates.
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01005-2512Resistor Specifications
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100mΩ-500MΩTrimming Range
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±0.05/±0.1/±0.5/±1(%)Adjustment Accuracy
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Product Advantages
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Applications
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Specifications
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Related Products
Product Advantages
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Self-Developed Laser Source – Cost-Effective & Reliable
Powered by JPT’s self-developed laser, tailored for specific applications with low cost and long lifespan. Built using the highest-performance components (fiber, crystal, pump source, etc.), each laser undergoes a 72-hour aging test to ensure long-term reliability.
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High Trimming Efficiency & Accuracy
Equipped with a high-speed, high-precision galvanometer, JPT’s proprietary fiber laser, and a self-developed high-speed precision measurement system, enabling closed-loop trimming control for fast and highly accurate resistance adjustment.
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Advanced Automation & Smart Functions
Integrated with power monitoring modules, automatic calibration of the measurement system, automatic trimming alignment, and electric control of material loading, meeting the needs of intelligent and automated production.
Applications
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Infrared Blade Width 17–25 μm -
Substrate Image -
Green Light Blade Width 8–9 μm -
Ultraviolet Blade Width 7–8 μm
Laser Thin Film Trimmer
Specifications
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Standard
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Optional
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Substrate size
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Product Specification
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Trimming Range
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Trimming Accuracy
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Channel Quantity
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Laser Parameters
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Galvo Scan Range
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Cutting Speed
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Blade Types
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Line Width
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Standard
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Substrate size5060 / 6070 / 8084
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Product Specification01005-2512
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Trimming Range100mΩ~20MΩ
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Trimming Accuracy±0.05%、±0.1%、±1%
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Channel Quantity15 conventional relay boards, 240 channels
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Laser ParametersIR>30W@23kHz;
GR＞2W@80kHz;
UV≥0.8W@80kHz -
Galvo Scan RangeIR: 12mm × 75mm@F125;
GR: 12mm × 60mm@F100;
UV: 12mm × 60mm@F103 -
Cutting Speed1mm/s~ 600mm/s
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Blade TypesSingle Blade, L-Blade, Double Blade, IL-Blade, Multi-Blade (serpentine cutting), U-Blade, V-Blade, Chamfer Blade, J-Blade
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Line WidthIR: 17μm～25μm@F125;
GR: 8μm～12μm@F100;
UV: 6μm～10μm@F103
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Optional
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Substrate sizeCustomized according to customer material sheet size
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Product Specification/
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Trimming Range20mΩ~500mΩ
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Trimming Accuracy±0.05%、±0.1%、±1%
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Channel QuantityExpandable to 15 ultra-low resistance relay boards with 240 channels
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Laser ParametersIR：30μm～50μm@F160
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Galvo Scan Range12mm × 100mm@F160
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Cutting Speed1mm/s~ 600mm/s
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Blade Types/
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Line WidthIR：30μm～50μm@F160
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Related Products
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Laser Thin Film TrimmerMeasurement range 100mΩ-500MΩ, measurement accuracy ±0.01%, supports multiple resistance specifications
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Laser Thick Film TrimmerResistance adjustment range 100mΩ～20MΩ, used for laser resistance adjustment of chip thick film resistors/hybrid circuits (thick film) on ceramic substrates
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Laser ScriberFront and back line repeatability less than ±5 μm, achieving ±0.75μm/70mm straightness and ±1μm positioning accuracy
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Single Chip-resistor TesterUsed for first inspection before laser trimming, re-measurement or final inspection after laser trimming
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High Voltage Resistor TesterUsed to test single-chip resistor substrates, with the withstand voltage characteristics of each resistor before and after resistance adjustment
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TCR TesterUsed for testing the TCR values of individual resistors on single-chip resistor substrates
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Inductor Laser Peeling MachineFor laser removal of resin layers/enamel layers on molded inductors and wound inductors
