Laser Scriber
The JPT Laser Scriber utilizes optical beam expansion, shaping, and focusing to concentrate the laser beam to the micron level. The focused beam scans back and forth across the material surface, melting and vaporizing the substrate to form grooves of a defined depth, thereby achieving precise scribing.
As a key piece of equipment in chip resistor production, the laser scribing machine is designed for laser scribing of chip resistor substrates based on ceramic substrates and flexible PCB boards.
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＜±5μmFront-to-Back Alignment Accuracy
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10-20µm(UV)、20-50µm(IR)Scribing width
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Product Advantages
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Applications
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Specifications
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Related Products
Product Advantages
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Self-Developed Laser – Cost-Effective & Reliable
Powered by JPT’s self-developed laser, customizable for specific applications with low cost and long service life. Built with top-performance components (fiber, crystal, pump source, etc.) and validated through a 72-hour aging test to ensure long-term reliability.
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Dual Cutting Modes – Scribing & Drilling
Supports both scribing and drilling. Scribing: Horizontal and vertical lines, executed with single or multiple passes. Drilling: Evenly spaced holes triggered by precise positioning. Both scribing and drilling allow skipping of intersection points to avoid excessive depth at crossing areas.
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High Alignment Precision – Front & Back Scribing
The relative alignment accuracy between front and back scribing (the deviation between grooves on both sides of the substrate) can reach less than ±5 µm, ensuring superior precision.
Applications
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Infrared Scribing – 2D Top View -
Infrared Scribing – 3D Top View -
Scribing Depth: 0.0755 mm -
Ultraviolet Scribing – 2D Top View -
UV Scribing 3D Top View
Laser Scriber
Specifications
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Standard
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Optional
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Product Specification
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Scribing Depth
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Scribing Width
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Laser Source
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Linearity
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Verticality
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Standard
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Product Specification01005-2512
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Scribing Depth10μm ~ 500μm
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Scribing Width20μm ~ 50μm
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Laser SourceCW 200W、MOPA 20W
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Linearity1μm/70mm
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Verticality2μm/70mm
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Optional
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Product Specification/
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Scribing Depth/
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Scribing WidthDepth 10 µm ~ 100 µm: line width < 30 µm Depth 100 µm ~ 500 µm: line width 30 µm ~ 50 µm
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Laser SourceCW laser for ceramic scribing; MOPA laser for thin-film scribing
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Linearity/
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Verticality/
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Related Products
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Laser Thin Film TrimmerMeasurement range 100mΩ-500MΩ, measurement accuracy ±0.01%, supports multiple resistance specifications
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Laser Thick Film TrimmerResistance adjustment range 100mΩ～20MΩ, used for laser resistance adjustment of chip thick film resistors/hybrid circuits (thick film) on ceramic substrates
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Laser ScriberFront and back line repeatability less than ±5 μm, achieving ±0.75μm/70mm straightness and ±1μm positioning accuracy
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Single Chip-resistor TesterUsed for first inspection before laser trimming, re-measurement or final inspection after laser trimming
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High Voltage Resistor TesterUsed to test single-chip resistor substrates, with the withstand voltage characteristics of each resistor before and after resistance adjustment
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TCR TesterUsed for testing the TCR values of individual resistors on single-chip resistor substrates
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Inductor Laser Peeling MachineFor laser removal of resin layers/enamel layers on molded inductors and wound inductors
