Glass Ink Drilling Equipment

The Glass Ink Drilling Equipment is specifically developed for display applications, such as mobile phones, tablets, and computers. It is equipped with a CCD vision positioning system, HSC laser module, AOI, and transmittance detection module.

1000mm/s

Maximum Processing Speed
650×550mm

Maximum Work Area
±20um

Processing Accuracy

Product Advantages
Specifications
Related Products
Application Solutions

Product Advantages

High-Precision Module for Consistent Drilling

Equipped with a high-precision XY platform module to ensure drilling accuracy and repeatability, meeting strict process requirements.
Fully Enclosed Optical Path for Stable, Clean Operation

The optical cavity adopts a fully enclosed design, providing dustproof and contamination-free protection, ensuring long-term stable performance of the laser module.
Customized HSC Laser Module for Diverse Applications

Supports customization of various hole diameters and taper designs, adaptable to different glass ink materials and application needs.
Intelligent Inspection System for Quality Assurance

Integrated with online aperture and transmittance monitoring, providing real-time feedback on processing quality to ensure consistency and yield.

Specifications

Product Model

Glass Ink Drilling Equipment

Laser Source
Laser Power
Cooling Method
Beam Quality
Focusing Method
Focal Spot Size
Equipment Dimensions
Maximum Processing Speed
Maximum Work Area
Galvo Processing Area
Processing Accuracy

Glass Ink Drilling Equipment
- Laser Source
  
  UV Nanosecond
- Laser Power
  
  10W
- Cooling Method
  
  Constant Temperature Water Cooling
- Beam Quality
  
  M² < 1.3
- Focusing Method
  
  Galvanometer
- Focal Spot Size
  
  10 ± 5 µm
- Equipment Dimensions
  
  1600 mm (L) × 1900 mm (W) × 1800 mm (H)
- Maximum Processing Speed
  
  1000 mm/s
- Maximum Work Area
  
  650 mm × 550 mm
- Galvo Processing Area
  
  50 mm × 50 mm
- Processing Accuracy
  
  ± 20 μm