Solder Ball Placement & Welding Module
The solder ball placement module delivers individual solder balls to the nozzle, where they are heated by a laser beam under an inert gas atmosphere to a molten state. The molten solder droplet is then ejected onto the workpiece surface, where it wets, diffuses, and forms a bonding layer, ensuring a reliable connection.
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0.2≤Φ≤1.8mmSolder ball size
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4-6 pxs/sPlacement speed
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±5 umVision Positioning Accuracy
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Product Advantages
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Applications
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Specifications
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Related Products
Product Advantages
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High-Speed Precision
Fast solder ball welding in an inert gas atmosphere with placement efficiency up to 4–6 pcs/s. The entire laser heating and droplet ejection process is completed within 0.2 seconds.
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Independent & Flexible Control
Proprietary ball placement mechanism and control system with flexible configuration and easy maintenance.
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Wide Size Compatibility
Supports a broad range of solder ball diameters (0.2–1.8 mm), meeting diverse workpiece size requirements.
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Micro-Precision Positioning
Equipped with a high-precision CCD vision system, enabling accurate soldering of micro-components and delicate devices.
Applications
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Single-Point Matrix Welding -
Fixed-Point Consistency Test -
Matrix Repeated Welding
Specifications
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Solder Ball Placement & Welding Module
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Laser Wavelength
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Laser Power
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Solder Ball Size
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Placement Speed
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Optical Fiber Interface
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Vision Positioning Accuracy
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Cooling Method
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Collimation Distance
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Focal Length
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Overall Dimensions
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Weight
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Solder Ball Placement & Welding Module
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Laser Wavelength1070 nm, 976 nm, 915 nm
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Laser Power75-300W
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Solder Ball Size0.2 mm ≤ Φ ≤ 1.8 mm
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Placement Speed4 - 6 pxs/s
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Optical Fiber InterfaceD80 SMA905 FC
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Vision Positioning Accuracy±5 µm
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Cooling MethodAir Cooled
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Collimation Distance18 mm, 40 mm
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Focal Length45mm, 70mm
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Overall Dimensions150 × 300 × 90 mm
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Weight2.5 kg
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Related Products
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Full-Field Scanning Vision Positioning ModuleThe coordinate mapping algorithm corrects CCD light source drift and distortion caused by the F-theta lens
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Solder Ball Placement & Welding ModuleDelivers individual solder balls to the nozzle, where they are heated by a laser beam under an inert gas atmosphere to a molten state
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Laser Coaxial Wire Feeding Welding HeadDelivers the metal wire through the center of the ring-shaped spot, where it quickly melts at the laser focal point to form a stable molten pool
