M8 20-50W
20-50W
The JPT M8 series laser adopts a Master Oscillator Power Amplifier (MOPA) architecture, supporting independent adjustment of pulse width and pulse frequency. Building upon the performance of its predecessors, the M8 series has been specifically optimized for pulse peak power and beam quality, delivering exceptional beam characteristics even under high-power operation.With a maximum peak power exceeding 100kW, this series is particularly suitable for demanding applications such as glass drilling, where both high peak power and brightness are critical requirements.
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50kwHigh Peak Power
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<1.4Excellent Beam Quality
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4mJMaximum pulse energy
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Product Advantages
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Applications
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Specifications
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Related Products
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Application Solution
Product Advantages
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High Peak Power
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Excellent Beam Quality
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Compact Integrated Design
Applications
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Glass Drilling -
Plastic Cutting -
Glass Frosting -
Titanium Coloring -
Metal Matte Surface Polishing
Specifications
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YDFLP-50-M8-M-R
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YDFLP-20-M8-S-R
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Nominal Average Output Power (W)
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Beam Quality (m2)
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Maximum Pulse Energy (mJ)
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Pulse Width (ns)
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Output Power Tuning Range (kHz)
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Output Beam Diameter (mm)
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Operating Voltage (V)
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Cooling Method
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Laser Weight (kg)
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Dimensions (mm)
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YDFLP-50-M8-M-R
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Nominal Average Output Power (W)50
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Beam Quality (m2)< 1.4
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Maximum Pulse Energy (mJ)4
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Pulse Width (ns)1~350
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Output Power Tuning Range (kHz)1~4000
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Output Beam Diameter (mm)7.0±1.0
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Operating Voltage (V)24 (DC)
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Cooling MethodAir Cooled
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Laser Weight (kg)4
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Dimensions (mm)337×130×100
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YDFLP-20-M8-S-R
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Nominal Average Output Power (W)20
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Beam Quality (m2)< 1.4
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Maximum Pulse Energy (mJ)1.1
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Pulse Width (ns)1~350
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Output Power Tuning Range (kHz)1~4000
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Output Beam Diameter (mm)7.0±1.0
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Operating Voltage (V)100~240 (AC)
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Cooling MethodAir Cooled
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Laser Weight (kg)2.7
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Dimensions (mm)272×105×76.2
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Related Products
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M7 20-100W20-100W
Laser etching; Surface treatment; Precision cleaning; Thin sheet metal cutting & welding; Deep laser engraving; On-the-fly marking
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M7 200-300W200-300W
Laser etching; Surface treatment; Laser cleaning; On-the-fly marking; Deep laser engraving
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M7 500-1000W500-1000W
Laser etching; Surface treatment; Laser cleaning; On-the-fly marking; Deep laser engraving
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M8 20-50W20-50W
Laser etching; Thin sheet drilling; Anode stripping; Coating removal; Thin sheet cutting
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M8 120-300W120-300W
Glass drilling; Thin sheet drilling; Mirror frosting; Anode stripping; Coating removal; Thin sheet cutting
Application Solution
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New EnergyFor batteries, JPT offers one-stop laser solutions from cell processing to PACK assembly. In photovoltaics, our applications span glass drilling, cell cleaving, PERC hole drilling, PL inspection, and perovskite patterning—driving efficient green energy manufacturing.
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Laser MarkingJPT’s laser marking solutions, powered by our self-developed high-performance MOPA pulsed fiber lasers and proprietary optical technologies, deliver non-contact processing with exceptional precision, ultra-high speed, and permanent marking capability. Widely adopted across global high-end manufacturing sectors—including 3C electronics, automotive components, and medical device production—our systems support a wide range of materials such as metals, plastics, and ceramics, enabling efficient marking of QR codes, logos, serial numbers, and more.
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Laser WeldingJPT’s laser welding solutions, powered by our self-developed high-power continuous fiber lasers and precision optical control technologies, offer deep penetration, narrow weld seams, low heat input, and minimal distortion—making them ideal for high-precision, high-speed welding applications such as new energy manufacturing, automotive components, and precision electronics, covering applications including power battery casing welding, copper tab welding, cover sealing, and modular metal structure welding.
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Laser DrillingJPT's laser drilling technology is an advanced non-contact microfabrication process that uses high-energy laser beams to precisely create micro-holes, through-holes, or custom-shaped holes on or within material surfaces. By leveraging the interaction between the laser and the material—such as melting, vaporization, or photochemical decomposition—this process achieves highly efficient material removal. Offering high precision, high efficiency, and zero mechanical stress, it is suitable for processing metals, ceramics, glass, films, and more, with wide applications in electronics manufacturing, aerospace, medical devices, and new energy industries.
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