Sparrow-355/532
800mW-2W
The Sparrow-355-2 represents a newly upgraded air-cooled ultraviolet solid-state laser, featuring further reduced dimensions and weight for optimized customer installation space efficiency.
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355/532Wavelength
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800mW-2WAverage Power
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Air CooledCooling Method
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Product Advantages
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Applications
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Specifications
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Related Products
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Application Solutions
Product Advantages
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Air-Cooled Structure with Intelligent Speed Regulation
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Compact Form Factor: Reduced Size, Lighter Weight, Enhanced Aesthetics
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Advanced EMI Resistance | High-Efficiency Thermal Management | User-Friendly GUI Interface
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Tool-Free Installation | Maintenance-Free Operation
Applications
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Mobile phone Case Marking -
Cover Film Cutting -
Glass Marking -
Thin Film Drilling -
SLA Photocuring -
Plastic Marking
Specifications
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Sparrow-355-800
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Sparrow-355-2
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Sparrow-532-2
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Wavelength (nm)
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Average Power (W)
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Pulse Width (ns)
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Frequency Range (kHz)
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Spatial Mode
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M²
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Beam Circularity
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Beam Full Divergence Angle (mrad)
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Beam Diameter (mm)
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Polarization Ratio
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Polarization Orientation
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Average Power Stability (hr)
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Pulse-to-Pulse Stability (kHz)
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Operating Temp.&RH (℃)
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Storage Temp.&RH (℃)
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Cooling Method
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Electricity Requirement (V)
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Average Power Consumption (W)
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Dimensions (L×W×H) (mm)
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Laser Weight (kg)
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Sparrow-355-800
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Wavelength (nm)355
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Average Power (W)＞800m@50kHz
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Pulse Width (ns)＜15@50kHz
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Frequency Range (kHz)30~150
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Spatial ModeTEM00
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M²≤1.3
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Beam Circularity＞85%
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Beam Full Divergence Angle (mrad)＜2.5
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Beam Diameter (mm)0.45±0.15
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Polarization Ratio＞100:1
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Polarization OrientationHorizontal
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Average Power Stability (hr)RMS≤5%@24
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Pulse-to-Pulse Stability (kHz)RMS≤5%@40
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Operating Temp.&RH (℃)0~35; ＜80%
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Storage Temp.&RH (℃)-15~50; ＜90%
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Cooling MethodAir Cooled
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Electricity Requirement (V)12 (DC)
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Average Power Consumption (W)＜75
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Dimensions (L×W×H) (mm)173.5×93.2×131.1
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Laser Weight (kg)2.6
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Sparrow-355-2
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Wavelength (nm)355
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Average Power (W)＞2@30kHz
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Pulse Width (ns)＜15@30kHz
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Frequency Range (kHz)20~200
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Spatial ModeTEM00
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M²≤1.2
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Beam Circularity＞90%
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Beam Full Divergence Angle (mrad)≤2
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Beam Diameter (mm)0.45±0.15
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Polarization Ratio＞100:1
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Polarization OrientationHorizontal
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Average Power Stability (hr)RMS≤3%@24
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Pulse-to-Pulse Stability (kHz)RMS≤3%@30
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Operating Temp.&RH (℃)0~40; ＜80%
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Storage Temp.&RH (℃)-15~50; ＜90%
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Cooling MethodAir Cooled
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Electricity Requirement (V)12 (DC)
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Average Power Consumption (W)＜120
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Dimensions (L×W×H) (mm)200.5×114×137
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Laser Weight (kg)4.32
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Sparrow-532-2
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Wavelength (nm)532
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Average Power (W)＞2@80kHz
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Pulse Width (ns)＜15@80kHz
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Frequency Range (kHz)30~150
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Spatial ModeTEM00
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M²≤1.3
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Beam Circularity＞85%
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Beam Full Divergence Angle (mrad)＜3.0
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Beam Diameter (mm)0.45±0.15
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Polarization Ratio＞100:1
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Polarization OrientationVertical
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Average Power Stability (hr)RMS≤5%@24
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Pulse-to-Pulse Stability (kHz)RMS≤5%@80
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Operating Temp.&RH (℃)0~35; ＜80%
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Storage Temp.&RH (℃)-15~50; ＜90%
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Cooling MethodAir Cooled
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Electricity Requirement (V)12 (DC)
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Average Power Consumption (W)＜75
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Dimensions (L×W×H) (mm)173.4×92×129.6
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Laser Weight (kg)2.6
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Related Products
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LARK 355-3/53-5W
Laser marking on various plastics (PE, PET, etc.)；Solar cell scribing/dicing；Cutting of flexible/brittle materials
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SEAL 355-3/53-5W
Laser marking on various plastics (PE, PET, etc.)；Solar cell scribing/dicing；Cutting of flexible/brittle materials
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SEAL355-10/15/20/3010-30W
3D Package Manufacturing, Wafer Scribing, Brittle Materials Drilling, Flex Materials Cutting
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SEAL 532-7/10/20/307-30W
Flex Materials Cutting, IC Package Trimming, Wafer Scribing
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Sparrow-355/532800mW-2W
3D Package Manufacturing, IC Package Trimming, Wafer Scribing, Solar Cell Scribing
