SEAL 355-3/5
3-5W
The Seal-355-3SE and 5SE are upgraded JPT UV laser models designed for stable industrial processing. Each 355nm UV laser adopts an integrated monolithic structure that combines the optical path and external drive circuitry in a single unit, improving electromagnetic interference resistance and overall system stability.
A fully sealed enclosure protects the solid-state UV laser from dust and moisture, enabling reliable operation in demanding production environments. As a high-performance UV DPSS laser, the Seal series delivers the precision and durability required for applications using ultraviolet lasers and other 355nm laser systems.
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355nmWavelength
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3-5WAverage Power
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Water CooledCooling Method
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Product Advantages
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Applications
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Specifications
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Related Products
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Application Solutions
Product Advantages
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Integrated optoelectronic design, EMI-resistant, one-touch operation
The monolithic design combines the optical path and drive circuitry in one unit, helping the JPT UV laser maintain stable operation in electrically demanding environments.
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Fully sealed structure, dustproof & moisture-resistant
A sealed enclosure protects the 355nm UV laser from dust and moisture, supporting reliable performance in humid or harsh industrial conditions.
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Compact laser design, space-saving installation
The space-saving UV DPSS laser design allows easier integration into precision marking and micromachining equipment.
Applications
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Mobile phone Case Marking -
Cover Film Cutting -
Glass Marking -
Thin Film Drilling -
SLA Photocuring -
Plastic Marking
Specifications
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Seal-355-3E
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Seal-355-5E
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Seal-355-3SE
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Seal-355-5SE
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Wavelength (nm)
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Average Power (W)
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Pulse Width (ns)
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Frequency Range (kHz)
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Spatial Mode
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M²
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Beam Circularity
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Beam Full Divergence Angle (mrad)
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Beam Diameter (mm)
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Polarization Ratio
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Polarization Orientation
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Average Power Stability (hr)
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Pulse-to-Pulse Stability (kHz)
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Operating Temp.&RH (℃)
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Storage Temp.&RH (℃)
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Cooling Method
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Cooling Capacity Requirement (W)
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Electricity Requirement (V)
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Average Power Consumption (W)
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Dimensions (L×W×H) (mm)
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Laser Weight (kg)
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Seal-355-3E
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Wavelength (nm)355
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Average Power (W)＞3@30kHz
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Pulse Width (ns)<20@30kHz
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Frequency Range (kHz)20-200
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Spatial ModeTEM00
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M²≤1.2
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Beam Circularity>90%
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Beam Full Divergence Angle (mrad)≤2
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Beam Diameter (mm)0.55±0.15
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Polarization Ratio＞100:1
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Polarization OrientationHorizontal
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Average Power Stability (hr)RMS≤3%@24
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Pulse-to-Pulse Stability (kHz)RMS≤3%@30
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Operating Temp.&RH (℃)0~40; ＜80%
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Storage Temp.&RH (℃)-15~50; ＜90%
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Cooling MethodWater Cooled
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Cooling Capacity Requirement (W)500W
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Electricity Requirement (V)12 (DC)
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Average Power Consumption (W)＜180
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Dimensions (L×W×H) (mm)263×120×105
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Laser Weight (kg)6.0
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Seal-355-5E
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Wavelength (nm)355
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Average Power (W)＞5@40kHz
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Pulse Width (ns)<20@40kHz
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Frequency Range (kHz)20-200
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Spatial ModeTEM00
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M²≤1.2
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Beam Circularity>90%
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Beam Full Divergence Angle (mrad)≤2
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Beam Diameter (mm)0.55±0.15
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Polarization Ratio＞100:1
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Polarization OrientationHorizontal
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Average Power Stability (hr)RMS≤3%@24
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Pulse-to-Pulse Stability (kHz)RMS≤3%@40
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Operating Temp.&RH (℃)0~40; ＜80%
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Storage Temp.&RH (℃)-15~50; ＜90%
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Cooling MethodWater Cooled
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Cooling Capacity Requirement (W)500W
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Electricity Requirement (V)12 (DC)
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Average Power Consumption (W)＜180
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Dimensions (L×W×H) (mm)263×120×105
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Laser Weight (kg)6.0
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Seal-355-3SE
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Wavelength (nm)355
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Average Power (W)＞3@30kHz
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Pulse Width (ns)<20@30kHz
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Frequency Range (kHz)20-200
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Spatial ModeTEM00
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M²≤1.2
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Beam Circularity>90%
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Beam Full Divergence Angle (mrad)≤2
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Beam Diameter (mm)0.55±0.15
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Polarization Ratio＞100:1
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Polarization OrientationHorizontal
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Average Power Stability (hr)RMS≤3%@24
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Pulse-to-Pulse Stability (kHz)RMS≤3%@30
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Operating Temp.&RH (℃)0~40; ＜80%
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Storage Temp.&RH (℃)-15~50; ＜90%
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Cooling MethodWater Cooled
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Cooling Capacity Requirement (W)500W
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Electricity Requirement (V)12 (DC)
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Average Power Consumption (W)＜180
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Dimensions (L×W×H) (mm)263×120×104.5
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Laser Weight (kg)4.8
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Seal-355-5SE
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Wavelength (nm)355
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Average Power (W)＞5@40kHz
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Pulse Width (ns)<20@40kHz
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Frequency Range (kHz)20-200
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Spatial ModeTEM00
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M²≤1.2
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Beam Circularity>90%
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Beam Full Divergence Angle (mrad)≤2
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Beam Diameter (mm)0.55±0.15
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Polarization Ratio＞100:1
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Polarization OrientationHorizontal
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Average Power Stability (hr)RMS≤3%@24
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Pulse-to-Pulse Stability (kHz)RMS≤3%@40
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Operating Temp.&RH (℃)0~40; ＜80%
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Storage Temp.&RH (℃)-15~50; ＜90%
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Cooling MethodWater Cooled
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Cooling Capacity Requirement (W)500W
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Electricity Requirement (V)12 (DC)
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Average Power Consumption (W)＜180
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Dimensions (L×W×H) (mm)263×120×104.5
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Laser Weight (kg)4.8
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Related Products
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LARK 355-3/53-5W
Add comparisonvs- Lark-355-3A
- Lark-355-3ASE
- Lark-355-5A
- Lark-355-5ASE
Laser marking on various plastics (PE, PET, etc.)；Solar cell scribing/dicing；Cutting of flexible/brittle materials
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SEAL 355-3/53-5W
Add comparisonvs- Seal-355-3E
- Seal-355-5E
- Seal-355-3SE
- Seal-355-5SE
Laser marking on various plastics (PE, PET, etc.)；Solar cell scribing/dicing；Cutting of flexible/brittle materials
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SEAL355-10/15/20/3010-30W
Add comparisonvs- Seal-355-10S
- Seal-355-15S
- Seal-355-20S
- Seal-355-30S
- Seal-355-10E
- Seal-355-15E
3D Package Manufacturing, Wafer Scribing, Brittle Materials Drilling, Flex Materials Cutting
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SEAL 532-7/10/20/307-30W
Add comparisonvs- Seal-532-7
- Seal-532-10
- Seal-532-20
- Seal-532-30
Flex Materials Cutting, IC Package Trimming, Wafer Scribing
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Sparrow-355/532800mW-2W
Add comparisonvs- Sparrow-355-800
- Sparrow-355-2
- Sparrow-532-2
3D Package Manufacturing, IC Package Trimming, Wafer Scribing, Solar Cell Scribing
Application Solutions
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New EnergyFor batteries, JPT offers one-stop laser solutions from cell processing to PACK assembly. In photovoltaics, our applications span glass drilling, cell cleaving, PERC hole drilling, PL inspection, and perovskite patterning—driving efficient green energy manufacturing.
Learn More -
Laser CuttingJPT’s laser cutting solutions, powered by our self-developed high-energy-density lasers and precision optical control systems, enable high-accuracy thermal cutting across a variety of materials. Delivering narrow kerfs, clean edges, and minimal heat-affected zones, these solutions ensure superior quality in every cut. Applicable to metals, power battery materials, flexible printed circuits (FPC), ceramics, and more, JPT laser cutting technology delivers outstanding efficiency and consistency in sectors such as new energy manufacturing, precision electronics, and semiconductor device production.
Learn More -
Laser DrillingJPT's laser drilling technology is an advanced non-contact microfabrication process that uses high-energy laser beams to precisely create micro-holes, through-holes, or custom-shaped holes on or within material surfaces. By leveraging the interaction between the laser and the material—such as melting, vaporization, or photochemical decomposition—this process achieves highly efficient material removal. Offering high precision, high efficiency, and zero mechanical stress, it is suitable for processing metals, ceramics, glass, films, and more, with wide applications in electronics manufacturing, aerospace, medical devices, and new energy industries.
Learn More
