JPT-LIT 20 Femtosecond Laser

With deep expertise in lasers, JPT provides advanced optical calibration and inspection systems for electronics. Combining optical design, vision algorithms, and motion control, we deliver intelligent, high-precision solutions that empower the industry.

JPT integrates core laser and automation technologies for wafer trimming, ceramic cutting, glass drilling, and marking. Our high-performance lasers and intelligent equipment enhance precision, yield, and process consistency across MLCC, LTCC, and IC substrates.

For batteries, JPT offers one-stop laser solutions from cell processing to PACK assembly. In photovoltaics, our applications span glass drilling, cell cleaving, PERC hole drilling, PL inspection, and perovskite patterning—driving efficient green energy manufacturing.

JPT’s laser marking solutions, powered by our self-developed high-performance MOPA pulsed fiber lasers and proprietary optical technologies, deliver non-contact processing with exceptional precision, ultra-high speed, and permanent marking capability. Widely adopted across global high-end manufacturing sectors—including 3C electronics, automotive components, and medical device production—our systems support a wide range of materials such as metals, plastics, and ceramics, enabling efficient marking of QR codes, logos, serial numbers, and more.

JPT's laser drilling technology is an advanced non-contact microfabrication process that uses high-energy laser beams to precisely create micro-holes, through-holes, or custom-shaped holes on or within material surfaces. By leveraging the interaction between the laser and the material—such as melting, vaporization, or photochemical decomposition—this process achieves highly efficient material removal. Offering high precision, high efficiency, and zero mechanical stress, it is suitable for processing metals, ceramics, glass, films, and more, with wide applications in electronics manufacturing, aerospace, medical devices, and new energy industries.