The focused high energy density laser beam is irradiated on the surface of the material, that the material to be melted or vaporized instantaneously, and then using corresponding gas to blow away the melted or vaporized material. Finally, the cutting is formed with the movement of the laser beam.
laser first come out from the laser source and then pass though the collimeter and focusing system or other optical equipment, thus the surface of the material is irradiated by focused laser beam. The focused laser beam heats the material to vaporization or melting state using corresponding gas to blow away the melted or vaporized material. Finally the cutting is formed with the movement of the laser beam.
Application industry: solar cells(e.g. cutting silicon for solar), manufacturing and industrial, Jewelry, various electric vehicle components(e.g. battery foil), medical, Decoration and etc.
1.1-500ns pulse (Customizable) width adjustment range 2.Adjustable range of 1-4000k Hz, at the same time can be higher peak 3.Intelligent fan speed regulation 4.Large single pulse energy 5.Good beam quality 6.The first pulse has a fast response speed and no light leakage (no delay) 7.Good stability Note: The M7 series are powerful models can be customized according to your needs
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Silver cutting
Silver is a chemical element with the symbol Ag. It exhibits the highest electrical conductivity, thermal conductivity, and reflectivity of any metal. Silver is used in solar panels, water filtration, jewellery, ornaments, high-value tableware and utensils.
1. Silver cutting requests high peak power for MOPA fiber laser to achieve higher efficiency. 2. The MOPA fiber laser has stronger resistance for high reflectivity materials cutting , because isolater be setting inside MOPA fiber laser.
Laser Type: YDFLP-100-M7-M Lens: F100 Speed: 500 mm/s Pulse width: 500 ns
CFRP cutting
CFRP are composite materials that consist of two parts: a matrix and a reinforcement. The matrix is composed of polymer resin, and the Reinforcement is composed of carbon fiber. It is often used in such areas: Aerospace engineering, automotive engineering, sports goods, etc.
Precise heat control is critical during the cutting process, to avoid cutting section charring of the CFRP because of the heat effect.
Laser Type: Seal-355-15S; Lens: F100 Speed: 800 mm/s, Pulse width: 1 us Speed: 300 mm/s, Pulse width: 1us
Gold cutting
Gold is a chemical element with the symbol “Au”. In a pure form, it is a bright, slightly reddish yellow, dense, soft, malleable, and ductile metal. Gold is often used in the jewelry industry, electronics, medicine and even cooking.
1. The MOPA fiber laser has stronger resistance for high reflectivity materials cutting , because isolater be setting inside MOPA fiber laser. 2.Gold cutting requests high peak power for MOPA fiber laser to achieve higher efficiency.
Laser Type: YDFLP-100-M7-M Lens: F160 Speed: 500 mm/s Pulse width: 500 ns Time: 6 s
Artificial leather Cutting
Artificial leather, also called synthetic leather, is a material intended to substitute for leather in upholstery, clothing, footwear etc. It is usually made by a variety of different formulations of PVC and PU foaming or film processing and production.
The performance of cutting section will be more delicate and smooth by UV laser, compared with fiber laser.
Laser Type: Seal-355-5; Lens: F254 Speed: 1000 mm/s, Pulse width: 1 us Frequency: 40 kHz
Copper cutting
Copper is a chemical element with the symbol “Cu”It is a soft, malleable, and ductile metal with very high thermal and electrical conductivity. And copper doesn't easy be cutting because it is high reflectivity materials.
1. The MOPA fiber laser has stronger resistance for high reflectivity materials cutting , because isolater be setting inside MOPA fiber laser.2.Copper cutting requests high peak power for MOPA fiber laser to achieve higher efficiency.
JPT integrates leading technologies such as laser and optics, test and measurement, motion control and automation, machine vision. The company highly values intellectual property and has applied for more than 530 patents&software copyrights.
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M7 20W/30W
M7 60W/100W
M7 200W/350W
LP 20W/30W/50W
CL 100W/200W/300W
CW 200W/300W
CW 500W-1000W
CW 4000W-6000W
QCW 150W/1500W
CW 8000W/12000W
CW 1500W-3000W
SEAL 355
SEAL 532
LARK 355
PS IR/UV Picosecond Laser
SEAL 355-20S
915nm/976nm - 240W - 135μm
915nm - 280W - 135μm
976nm - 420W - 200μm
976nm - 500W - 200μm
450nm - 15W - 105μm
915nm - 15W - 105μm
915nm - 30W - 105μm
915nm - 45W - 105μm
915nm - 60W - 105μm
915nm - 110W - 105μm
Laser Scriber
High Voltage Resistor Tester
Single Chip Resistor Tester
Laser Trimmer
Hybrid Trimmer
HiPA-TT Light Transmittance Tester
PCB Laser Marking System
Ghost Writer & Reader - Subsurface 2D Barcode Marking & Reading System
High Precision 2DBC Laser-marking
Comprehensive VCSEL Module tester
Comprehensive LED-PD Integrated Module Testing
Six-sided Inspection Machine
