M7 20W/30W
M7 60W/100W
M7 200W/350W
LP 20W/30W/50W
CL 100W/200W/300W
CW 200W/300W
CW 500W-1000W
CW 4000W-6000W
QCW 150W/1500W
CW 8000W/12000W
CW 1500W-3000W
SEAL 355
SEAL 532
LARK 355
PS IR/UV Picosecond Laser
SEAL 355-20S
915nm/976nm - 240W - 135μm
915nm - 280W - 135μm
976nm - 420W - 200μm
976nm - 500W - 200μm
450nm - 15W - 105μm
915nm - 15W - 105μm
915nm - 30W - 105μm
915nm - 45W - 105μm
915nm - 60W - 105μm
915nm - 110W - 105μm
Laser Scriber
High Voltage Resistor Tester
Single Chip Resistor Tester
Laser Trimmer
Hybrid Trimmer
HiPA-TT Light Transmittance Tester
PCB Laser Marking System
Ghost Writer & Reader - Subsurface 2D Barcode Marking & Reading System
High Precision 2DBC Laser-marking
Comprehensive VCSEL Module tester
Comprehensive LED-PD Integrated Module Testing
Six-sided Inspection Machine
PRODUCT CATEGORIES
JPT produce a wide range of laser equipments. Our laser equipments include Ghost Writer & Reader - Subsurface 2D Barcode Marking & Reading System, High Precision 2DBC Laser-marking, PCB Laser Marking System, Automatic FPCB Laser Cutting and Placing System, Brittle Material Cutting & Splitting System, Brittle Materials Drilling System and so on. Our Subsurface 2D Barcode Marking & Reading System can mark invisible micro-sized 2D barcode inside glasses / sapphires, we design this marking and reading system which can mark dots as small as 2.5 μm. This system marks each sample with unique informationon, which helps for the traceability and anti-counterfeiting.
The High Precision 2DBC Laser-marking marks μ m-precision 2D barcode (2DBC) with pulsed-laser. The 2DBC is for product traceability. This machine has integrated onloading & offloading, global/local alignment, marking & inspection. Fully automation delivers high UPH.
The PCB Laser Marking system is tailored for fully automatic inline dynamic marking in the PCB industry. It realizes automatic loading & unloading using the SMEMA standard.
Automatic FPCB Laser Cutting and Placing System enjoys Twin laser cutting station design, for high cutting speed and accuracy: Fully automated cutting, PNP, loading & unloading.
Brittle Material Cutting & Splitting System emits Ultrafast laser with compatible cutting head to cut britile materials like sapphire glass, etc., and use CO 2 laser system for spliting after the cutting.
The Brittle Materials Drilling System adopts ultra-fast laser and high-speed galvo mirrors, which can drill holes in materials such as sapphire, glass, and wafer.
