M7 20W/30W
M7 60W/100W
M7 200W/350W
LP 20W/30W/50W
CL 100W/200W/300W
CW 200W/300W
CW 500W-1000W
CW 4000W-6000W
QCW 150W/1500W
CW 8000W/12000W
CW 1500W-3000W
SEAL 355
SEAL 532
LARK 355
PS IR/UV Picosecond Laser
SEAL 355-20S
915nm/976nm - 240W - 135μm
915nm - 280W - 135μm
976nm - 420W - 200μm
976nm - 500W - 200μm
450nm - 15W - 105μm
915nm - 15W - 105μm
915nm - 30W - 105μm
915nm - 45W - 105μm
915nm - 60W - 105μm
915nm - 110W - 105μm
High Voltage Resistor Tester
Single Chip Resistor Tester
Laser Trimmer
Hybrid Trimmer
HiPA-TT Light Transmittance Tester
PCB Laser Marking System
Ghost Writer & Reader - Subsurface 2D Barcode Marking & Reading System
High Precision 2DBC Laser-marking
Comprehensive VCSEL Module tester
Comprehensive LED-PD Integrated Module Testing
Six-sided Inspection Machine
Laser Scriber
1.The UV laser developed by HiPA has smaller heat effect, lower crater, finer laser beam and less filler. The vaporized groove has a V-shaped cross-section to facilitate the folding of the substrate and able to adapt to smaller resistance models, achieve smaller line width, upper and lower contrast camera monitoring and positioning design to improve positioning accuracy
2.Proprietary mechanical system with lighter hollowed U-shape fixture, reduce the quality of the fixture and improve the stability at high speed, and customize the XY motion module to ensure the accuracy of the scribing.Special machine design minimizes equipment vibration caused by XY linear module acceleration
3.Monitoring and positioning design of up and down control cameras to improve positioning accuracy
4.Innovatively designed for control sotiware for laser marking equipment, according to actual conditions, different operating parameters can be set, and customize the process graphics and process parameters according to production requirements to achieve the import function
5.Independently design mechanical system and vision system cooperation to achieve ±0.75μm/70mm straightness and ±1μm positioning accuracy
The laser scriber is applied to the scribing of various types of chip resistor ceramic substrates, including infrared and ultraviolet models. The device uses a laser with customized model parameters emits an extremely fine laser beam at adequate energy density. The beam goes through an optical beam shaping process and is then expanded, filtered and focused before hiting the ceramic substrate. This vaporizes the part of the substrate that is hit by the beam, forming scribe lines on the surface.
| Parameter | |
Model | S-008-S1-UF001 | S-008-S1-PF01 |
Substrate type | 0075 and above | 01005 and above |
Scribe line depth | 50±5μm(01005 Substrates) | 80±5μm(0201 Substrates) |
Min line width | 10μm | 20μm |
Repeatability | ±0.5μm | |
Absolute accuracy | ±1μm | |
Straightness | ±0.75μm/70mm | |
Max speed | 550mm/s(line module) | |
Dimensions | 1380×1130×1600mm^3 | |
