M7 20W/30W
M7 60W/100W
M7 200W/350W
LP 20W/30W/50W
CL 100W/200W/300W
CW 200W/300W
CW 500W-1000W
CW 4000W-6000W
QCW 150W/1500W
CW 8000W/12000W
CW 1500W-3000W
SEAL 355
SEAL 532
LARK 355
PS IR/UV Picosecond Laser
SEAL 355-20S
915nm/976nm - 240W - 135μm
915nm - 280W - 135μm
976nm - 500W - 200μm
450nm - 15W - 105μm
915nm - 15W - 105μm
915nm - 30W - 105μm
915nm - 45W - 105μm
915nm - 60W - 105μm
915nm - 110W - 105μm
Laser Scriber
High Voltage Resistor Tester
Single Chip Resistor Tester
Laser Trimmer
Hybrid Trimmer
HiPA-TT Light Transmittance Tester
PCB Laser Marking System
Ghost Writer & Reader - Subsurface 2D Barcode Marking & Reading System
High Precision 2DBC Laser-marking
Comprehensive VCSEL Module tester
Comprehensive LED-PD Integrated Module Testing
Six-sided Inspection Machine
976nm - 420W - 200μm
Key Features：
Multiple single emitter based diode laser, high reliability
1040-1200nm feedback protection
Applications：
Fiber laser pumping
Material processing
JPT has different kinds of semiconductor laser components and high-power laser modules. Semiconductor laser can be widely used in pump source, industrial processing, mechanical vision, medical and many other fields. Based on the mature coupling technology solution, thermal control and packaging process, the product has the advantages of high power, high beam quality, high stability, etc., and the product wavelength covers 400nm~1000nm, which meets the special requirements of power, brightness, wavelength control, spot uniformity and so on.
Unit | Min | Typical | Max | ||
Optical Parameters | Output Power | W | 420 | ||
Center Wavelength | nm | 973 | 976 | 979 | |
Spectral Width(FWHM) | nm | 6 | |||
95% Power Within NA | NA | 0.165 | |||
Back Reflection Isolation Range | nm | 1040 | 1060 | 1200 | |
Electrical Parameters | Conversion Efficiency | % | 45 | ||
Threshold Current | A | 1.45 | |||
Operating Current | A | 28 | 30 | ||
Operating Voltage | V | 33 | |||
Fiber Parameters | Core Diameter | μm | 200 | ||
Fiber Clad Diameter | μm | 220 | |||
Numerical Aperture | NA | 0.22 | |||
Fiber Length | m | 1.5 | |||
Fiber Bend Radius | mm | 60 | |||
Thermal Parameters | Package Operating Temperature | ℃ | 15 | 40 | |
Storage Temperature | ℃ | -20 | 85 | ||
Wavelength Temperature Coefficient | nm/℃ | 0.3 | |||
Lead Soldering Temperature | ℃ | 260 | |||
Lead Soldering Time | S | 10 | |||
