M7 20-100W
20-100W
JPT M7 Series is a high-power fiber laser adopting the Master Oscillator Power Amplifier (MOPA) configuration with a directly electrically modulated semiconductor laser seed source. It delivers exceptional beam characteristics and precise pulse shaping control.Compared to Q-switched fiber lasers, MOPA fiber lasers allow independent control of pulse frequency and pulse width. By adjusting these two key laser parameters, they achieve consistent high peak power output and broader compatibility with various marking substrates.Moreover, MOPA technology makes possible what Q-switched lasers cannot—higher output power, giving it a distinct advantage in high-speed marking applications.
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1.86kgMinimum laser weight
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2mJHigh pulse energy up to
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1064nmCentral emission wavelength
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Product Advantages
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Applications
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Specifications
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Related Products
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Application Solution
Product Advantages
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Independently adjustable pulse width & frequency
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Compact design for easy integration
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High level reliability
Applications
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Aluminum Oxidation Polishing -
Titanium Coloring -
Plastic Marking -
Metal Matte Surface Polishing -
Metal Foil Welding -
VIN/Frame Number Deep Engraving -
Stainless Steel Coloring -
Electrode Sheet Cutting
Specifications
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YDFLP-E2-20-M7-S-R
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YDFLP-E2-30-M7-S-R
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YDFLP-E2-60-M7-M-R
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YDFLP-E2-100-M7-M-R
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Beam Quality（M2）
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Armored Cable Length（m）
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Nominal Average Output Power (W)
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Maximum Pulse Energy（mJ）
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Pulse Repetition Rate Range (kHz)
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Pulse Width（ns）
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Cooling Method
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Operating Voltage (V)
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Nominal Power Consumption (W)
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Supply Power Demand (W)
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Central Emission Wavelength (nm)
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Emission Bandwidth @3dB (nm)
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Output Beam Diameter (mm)
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Laser Weight (kg)
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Dimensions (mm)
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YDFLP-E2-20-M7-S-R
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Beam Quality（M2）< 1.5
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Armored Cable Length（m）2
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Nominal Average Output Power (W)20
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Maximum Pulse Energy（mJ）1
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Pulse Repetition Rate Range (kHz)1~4000
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Pulse Width（ns）2~500
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Cooling MethodAir Cooled
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Operating Voltage (V)24（DC）
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Nominal Power Consumption (W)95
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Supply Power Demand (W)≥ 120
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Central Emission Wavelength (nm)1064
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Emission Bandwidth @3dB (nm)< 15
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Output Beam Diameter (mm)7.0 ± 1.0
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Laser Weight (kg)1.86
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Dimensions (mm)188 × 110 × 85.5
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YDFLP-E2-30-M7-S-R
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Beam Quality（M2）< 1.5
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Armored Cable Length（m）2
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Nominal Average Output Power (W)30
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Maximum Pulse Energy（mJ）1
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Pulse Repetition Rate Range (kHz)1 ~ 4000
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Pulse Width（ns）2 ~ 500
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Cooling MethodAir Cooled
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Operating Voltage (V)24（DC）
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Nominal Power Consumption (W)110
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Supply Power Demand (W)≥ 180
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Central Emission Wavelength (nm)1064
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Emission Bandwidth @3dB (nm)< 15
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Output Beam Diameter (mm)7.0±1.0
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Laser Weight (kg)1.86
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Dimensions (mm)188 × 110 × 85.5
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YDFLP-E2-60-M7-M-R
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Beam Quality（M2）< 1.5
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Armored Cable Length（m）3
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Nominal Average Output Power (W)60
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Maximum Pulse Energy（mJ）2
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Pulse Repetition Rate Range (kHz)1 ~ 4000
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Pulse Width（ns）2 ~ 500
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Cooling MethodAir Cooled
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Operating Voltage (V)24（DC）
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Nominal Power Consumption (W)230
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Supply Power Demand (W)≥ 280
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Central Emission Wavelength (nm)1064
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Emission Bandwidth @3dB (nm)< 15
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Output Beam Diameter (mm)7.0 ± 1.0
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Laser Weight (kg)4.1
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Dimensions (mm)253.3 × 205 × 75
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YDFLP-E2-100-M7-M-R
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Beam Quality（M2）< 1.6
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Armored Cable Length（m）3
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Nominal Average Output Power (W)100
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Maximum Pulse Energy（mJ）1.5
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Pulse Repetition Rate Range (kHz)1 ~ 4000
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Pulse Width（ns）2 ~ 500
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Cooling MethodAir Cooled
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Operating Voltage (V)24（DC）
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Nominal Power Consumption (W)340
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Supply Power Demand (W)≥ 450
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Central Emission Wavelength (nm)1064
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Emission Bandwidth @3dB (nm)< 15
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Output Beam Diameter (mm)7.0 ± 1.0
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Laser Weight (kg)8.2
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Dimensions (mm)336 × 255 × 90
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Related Products
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M7 20-100W20-100W
Laser etching; Surface treatment; Precision cleaning; Thin sheet metal cutting & welding; Deep laser engraving; On-the-fly marking
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M7 200-300W200-300W
Laser etching; Surface treatment; Laser cleaning; On-the-fly marking; Deep laser engraving
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M7 500-1000W500-1000W
Laser etching; Surface treatment; Laser cleaning; On-the-fly marking; Deep laser engraving
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M8 20-50W20-50W
Laser etching; Thin sheet drilling; Anode stripping; Coating removal; Thin sheet cutting
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M8 120-300W120-300W
Glass drilling; Thin sheet drilling; Mirror frosting; Anode stripping; Coating removal; Thin sheet cutting
Application Solution
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New EnergyFor batteries, JPT offers one-stop laser solutions from cell processing to PACK assembly. In photovoltaics, our applications span glass drilling, cell cleaving, PERC hole drilling, PL inspection, and perovskite patterning—driving efficient green energy manufacturing.
Learn More -
Laser MarkingJPT’s laser marking solutions, powered by our self-developed high-performance MOPA pulsed fiber lasers and proprietary optical technologies, deliver non-contact processing with exceptional precision, ultra-high speed, and permanent marking capability. Widely adopted across global high-end manufacturing sectors—including 3C electronics, automotive components, and medical device production—our systems support a wide range of materials such as metals, plastics, and ceramics, enabling efficient marking of QR codes, logos, serial numbers, and more.
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Laser WeldingJPT’s laser welding solutions, powered by our self-developed high-power continuous fiber lasers and precision optical control technologies, offer deep penetration, narrow weld seams, low heat input, and minimal distortion—making them ideal for high-precision, high-speed welding applications such as new energy manufacturing, automotive components, and precision electronics, covering applications including power battery casing welding, copper tab welding, cover sealing, and modular metal structure welding.
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Laser DrillingJPT's laser drilling technology is an advanced non-contact microfabrication process that uses high-energy laser beams to precisely create micro-holes, through-holes, or custom-shaped holes on or within material surfaces. By leveraging the interaction between the laser and the material—such as melting, vaporization, or photochemical decomposition—this process achieves highly efficient material removal. Offering high precision, high efficiency, and zero mechanical stress, it is suitable for processing metals, ceramics, glass, films, and more, with wide applications in electronics manufacturing, aerospace, medical devices, and new energy industries.
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